Huawei Ascend P7 has set records that picked up interests from mobile using crowd when it was declared as one of the thinnest handsets of its generation or 2014 with its 6.5mm thickness. So who’s to blame when everybody’s expecting something more for its successor, the Ascend P8?
Ascend P8 is expected to have its official debut in January, 2015 during CES in Las Vegas, Nevada. However, this does not deter spreading rumors declaring advanced details about P7’s successor and Huawei’s next chief-ship for 2015. Featuring 5.2-inch touchscreen display and clocking up at HiSilicon Kirin 930 chipset assembled on TSMC’s 16nm process—which is still under its production stage—and an octa-core CPU, in 3GB RAM. Storage capacity highlights a huge 32GB internal compartment for your softcopies.
And surprises, surprises! It is said to use the 2.5D curved glass technology that iPhone 6 uses. The metal package or chassis adds premium feel and style, with its signature “porcelain texture” right at the back of the handset.
Despite the omission of details pertaining to its dimension, photos indicate thinness akin to its predecessor. Of course, we spectators will normally think that P8 will observe at least a few millimeters shedding off. Projecting the sides, one can see two eject slots meant for (one) SIM and (two) for microSD.
Expect Huawei Ascend P8 to be price tagged between $489-500 (US dollars).
Huawei Ascend P8 Specifications
- Display : 5.2” 1080p
- Chipset : HiSilicon Kirin 930, Octa-core
- RAM : 3GB
- OS : Google Lollipop 5.0 (most probably)
- Storage : (internal) 32GB; (external) with microSD slot—not specified amount